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FDB86563-F085
onsemi

FDB86563-F085

MFR #FDB86563-F085

FPN#FDB86563-F085-FL

MFRonsemi

Part DescriptionN-Channel 60 V 110A (Tc) 333W (Tc) Surface Mount TO-263 (D2PAK)
Datasheet
100692-Datasheet
Quote Onlymore info
Multiples of: 800more info
Prices are in USD
Flip Electronics may assess a Tariff Recovery Fee relating to Tariffs on subject countries, including but not limited to China. The final charge will be included on Flip’s invoice. Flip Electronics reserves the right to assess this charge whenever a tariff is incurred or as additional country of origin information is known, even if no Tariff Recovery Fee is initially quoted.

Product Attributes

Main CategorySemiconductors
CategoryDiscrete Semiconductors
Sub CategoryTransistors
Family NameFDB86563_F085
Lifecycle StatusActive
RoHSCompliant with Exemption
RoHS Exemption Type7(a), RoHS (2015/863)
ROHS ChinaNot Compliant
Reach StatusNot Compliant
Channel ModeEnhancement
ConfigurationN-Channel
Drain Source Voltage60V
Drive Voltage10V
FET FeatureN/R
FET OptionsN/R
FET TypeSingle
Gate to Source Voltage±20V
Input Capacitance10100pF
Input Capacitance Test Voltage30V
Life Cycle StatusActive
Maximum Continuous Drain Current110A (Tc)
Maximum Drain to Source Resistance1.8 mOhm @ 80A, 10V
Maximum Gate to Source Threshold Voltage4V @ 250µA
Maximum Junction Temperature175°C (TJ)
Maximum Power Dissipation333W (Tc)
Maximum Pulse Drain CurrentN/A
Maximum Total Gate Charge163nC
Maximum Total Gate Charge Test Voltage10V
Minimum Junction Temperature-55°C (TJ)
Package TypeTO-263 (D2PAK)
TechnologyMOSFET (Metal Oxide)
Typical Gate to Drain Charge18nC
Typical Gate to Source Charge163nC