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BPC10M6X2S200
Flip Electronics Manufacturing Services

BPC10M6X2S200

MFR #BPC10M6X2S200

FPN#BPC10M6X2S200-FL

MFRFlip Electronics Manufacturing Services

Legacy ManufacturerAmpleon

Datasheet
198973-Datasheet
Quote Onlymore info
Prices are in USD
Flip Electronics may assess a Tariff Recovery Fee relating to Tariffs on subject countries, including but not limited to China. The final charge will be included on Flip’s invoice. Flip Electronics reserves the right to assess this charge whenever a tariff is incurred or as additional country of origin information is known, even if no Tariff Recovery Fee is initially quoted.

Product Attributes

Main CategorySemiconductors
CategoryDiscrete Semiconductors
Sub CategoryTransistors
Family NameBPC10M6X2S200
Packaging TypeTray
Lifecycle StatusActive
ROHSCompliant
RoHs Exemption TypeRoHS (2015/863), Unknown
1dB Compression Point (P1dB)200W
3dB Compression Point (P3dB)N/A
Channel ModeEnhancement
Configuration2 N-Channel
Gain38dB
Gate to Source Voltage+3V, -6V
Life Cycle StatusActive
Maximum Continuous Drain CurrentN/A
Maximum Junction Temperature80°C
Maximum Operating Frequency433MHz
Maximum Operating Temperature80°C
Maximum Output PowerN/A
Minimum Junction Temperature-40°C
Minimum Operating FrequencyN/A
Minimum Operating Temperature-40°C
Noise FigureN/A
Noise Test Current100mA
Noise Test Voltage28V
Number of Element per Chip2
Package TypeModule
Signal TypeContinuous Wave, Pulse
Technology TypeN/A
Transistor TypeLDMOS
Typical Output Power200W
Voltage Rating65V