Quality is at the heart of who we are. Our tagline, “Quality demanded, quality delivered,” is not just a saying. It is what we live by; it’s the core driver in every business decision, transaction, and partnership.
Every Flip employee recognizes that they are part of the quality team and have a significant impact on the parts we distribute. The leadership team of our quality department is known internationally for their contributions to the industry and is highly regarded for their knowledge and expertise in both quality management systems and counterfeit mitigation techniques.
When critical requirements cannot be filled from the manufacturer’s channel, Flip’s best practices quality control program built on the AS9120:2016 and AS6081 standards is a vital process to safeguard our customers’ supply chain.
An international standard that defines an acceptable quality management system for a company. It supplies necessary detail to provide direction about what to include in their processes.
Fraudulent/Counterfeit Electronics Parts Avoidance Detection, Mitigation, and Disposition Distributors Standard.
At Flip, our dedication to quality goes beyond just inspection. Depending on your requirements, we have the ability to perform the following testing procedures:
This test is a very complex system that is used to evaluate the topography of a component and to make a determination about the authenticity of its surface.
The surface decapping systems we use are employed to remove the material surrounding the internal circuitry of a component. This allows engineering to determine whether the die is the correct part number and the revision level for that component.
Used to test and verify whether the component has any of the (6) elements banned by the RoHS directive. Its primary use, however, is to determine whether the lead plating is lead-based or lead-free. Some customers require the leads be leaded rather than lead-free. The XRF system will analyze the leads, make a determination, and provide a report of their authenticity.
A sample from each lot is placed into a heated solvent that will remove any illegally applied top coating to reveal alterations made to a part without the original manufacturer’s approval.
As part of the in-depth incoming inspection procedure, components shall have the part number, ink stamping, and the component surface validated to ensure authenticity.
The system will show the engineer whether the internals are the same from one component to the next. It is also used to determine the exact location of the die for easier decapping. This test is designed to locate any components that are different from the first component observed. It will determine whether a counterfeiter has placed good components at the front of the tape and then changed to an altered version later in the tape.
The solderability test system is used to determine whether the component’s connection points will allow the proper solder adhesion in the appropriate amount of time per the component’s specification data sheet.
Functional testing shall be available to all of our customers. This testing process will ensure that the product will function as described after being installed into the customer’s system.
Occasionally, components require leads to be straightened to bring them back into specification; or, upon customer request, the leads need be re-tinned to allow easier placement into the customer systems.